The semiconductor packaging and assembly equipment is
effectively utilized for an assimilated chip to perform, it requires to be
linked to the package or straight to the printed circuit. This includes wire
bonding, die-bonding, and dicing. Also, it is a back end procedure of chip
establishment. Semiconductor ICs around the several sectors has augmented the
requirement for semiconductor packaging and assembly equipment. The growth in
the involves of semiconductor IC designs mainstream fuels the market. In
the present era, it has been witnessed that there is an augment in the
requirement for semiconductor ICs that can function several functions. Subsequently,
the merchants have improved the semiconductor ICs with the multifaceted
architecture to address the increment in the requirement for multi-functional
ICs. The improvement of the complex semiconductor ICs is a critical aspect that
compels the market growth during the review duration.
According to the report analysis, ‘Asia-Pacific Semiconductor Packaging and Assembly
(P&A) Equipment Market: Insights and Forecast 2018-2025: Emphasis on
Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others
(Including Packaging)), Application (Consumer Electronics, Communication,
Automotive, Industrial, Other) and Country’ states that in
the Asia Pacific semiconductor packaging and assembly (P&A) equipment
market there are numerous key players which recently performing more positively
for leading the fastest market growth and registering the high value of market
share during the forecasted period while augment in the sales of smart phones
and other smart consumer electronic devices, developed medical applications and
equipment, increasing the scope in the Internet of Things and wide improvement
of new assembly procedure includes Amkor Technology Inc, Fujitsu Ltd., Toshiba
Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung
Electronics Co. Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd.,
ChipMOS Technologies Inc., Powertech Technology Inc., ASE Group and several
others.
In terms of revenue, the semiconductor packaging and
assembly equipment in Asia Pacific has accounted an astounding the growth with
positive CAGR during the review period of 2019-2025. The semiconductor
packaging and assembly equipment market in Asia Pacific region has observed an
overall an effective augment in the market dissemination in the last few years.
The Internet of Things and automation in automobiles has boomed up the
semiconductor market. The effective utilization of the semiconductor ICs for
automated driving, automatic braking system, GPS, power doors and windows has
further deteriorated the market growth.
Whereas, Taiwan receipts the upper hand in the
semiconductor packaging and assembly equipment technology market followed by
China. Taiwan vestiges well ahead of China in IC fabrication as Taiwanese
manufacturers have massive recompenses in technology over other regions
involving China. Not only has this, based on the application, the Semiconductor
packaging and assembly equipment technology market in Asia Pacific procured concentrated
revenues from communication. On the other hand, the automotive application sector
is estimated to display a wide growth in years to come owing to the augment in requirement
of automated automobiles.
Furthermore, on the basis of process, the die bonding
process controlled the overriding share in semiconductor packaging and assembly
equipment market. Base band is majorly incorporated into mobile and consumer
electronics devices, this is impelling the ascendancy of die bonding in the
market. Plating procedure is predicted to be the fastest increasing. Therefore,
in the near years, it is anticipated that the Asia Pacific Semiconductor Packaging
and Assembly Equipment market will increase more positively over the near
years.
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information on the research report, refer to below link:-
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Ken Research
Ankur Gupta, Head Marketing & Communications
Sales@kenresearch.com
+91-9015378249
Ken Research
Ankur Gupta, Head Marketing & Communications
Sales@kenresearch.com
+91-9015378249
