The
packaging of products & goods is essential to protect or prevent them from
the external and internal environments. Nowadays, the packaging has become a
necessary component primarily due to rising nuclear families & bachelor's
life has led a stipulate for ready to serve food where there is a need for
quality food or shelf life. Growing awareness for quality & increasing adoption
of technology and shelf life have resulted in the perception of smart packaging
that offers improved shelf life, display information on quality, monitors
freshness, improves safety, and is more convenient. The electronic packaging is
the highly developed type of smart packaging. It is used to send sound,
display, light, or electronic signals. This composes the packaging more secure,
attractive, and highly interactive. It is also used for cost reduction, brand
enhancement & protection, increasing sales, error prevention, user
friendliness, removing tedious procedures, automated data collection and
reduced crime etc.
According
to study, “Worldwide
Electronic Smart Packaging Market - Technologies (RFID, NFC, BLE and EAS),
Applications (Printed Sensor, Printed Touch, Printed Light, Printed RFID and
Printed Antennas), End-Users (Food, Beverage, Healthcare, Personal Care,
Logistics and Machineries), By Regions - Drivers, Opportunities, Trends, and
Forecasts, 2016-2022” some of the major companies that are currently
working in the worldwide electronic smart packaging market are Thin Film
Electronics ASA, Sealed Air, Smartrac N.V., PakSense, Bemis Company Inc.,
Ametek Inc., 3M Co., NEXX Systems Inc., RR Donnelley & Sons Co., Blue Spark
Technologies Inc., PST Sensors, Saralon GmbH, Printechnologics.
Based
on technology, worldwide electronic smart packaging market is segmented into
NFC, Electronic Article Surveillance (EAS), Radio Frequency Identification
(RFID) and Bluetooth Low Energy (BLE). Based on devices, the market is
bifurcated into transistor less circuits & materials, silicon chips &
conventional electronics, printed thin film transistor circuits (TFTCS),
disposable batteries, printed electronic displays & other new human
interfaces, sensors, piezoelectric and laminar microphones & loudspeakers.
Based on precursors, the market is segmented into barcodes & magnetic
stripes, written & printed information, electrical or mechanical &
chemical smart packaging, mechanical smart packaging and uncontrolled active packaging.
Based on application, market is defined as printed touch, printed light,
printed antennas (printed RFID antenna & printed NFC antenna), printed
security, printed heater, printed sensors, printed RFID and others. Moreover,
based on end-user, market is classified as beverage, logistics or transporting,
industry machineries, healthcare, food, personal care and others.
The
market of worldwide electronic smart packaging is primarily driven by increase
in technology adoption followed by growing consumer demand, reduction of life
span of food products, increasing adoption of wireless communications &
IoE, lack of organic products, and cloud computing low cost & less weight
and increasing ageing population etc. Apart from the major benefits, few hinder
factors include increasing competition leading to price war, followed by lack
of awareness about electronics in smart packaging. Furthermore, some of the
other key opportunities include improving market conditions & falling costs
and use of NFC technology.
Europe
is set to be the foremost region for electronic smart packaging market followed
by Asia Pacific & North America. The increasing spending on IoE
technologies, rising knowledge of printed electronic technologies in smart
packaging, and rising mobile subscriber base in the developing countries is
anticipated to drive growth of the market over the forecast period. It is
estimated that the worldwide electronic smart packaging market to accomplish US
$1,700.8 million, by 2022.
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Contact
Us:-
Ken
Research
Ankur
Gupta, Head Marketing & Communications
+91-9015378249